{"id":3431,"date":"2024-01-31T09:31:42","date_gmt":"2024-01-31T01:31:42","guid":{"rendered":"https:\/\/www.1ai.net\/?p=3431"},"modified":"2024-01-31T09:31:42","modified_gmt":"2024-01-31T01:31:42","slug":"semron%e7%ad%b9%e9%9b%86790%e4%b8%87%e7%be%8e%e5%85%83%ef%bc%8c%e7%94%a8%e4%ba%8e%e7%a7%bb%e5%8a%a8%e8%ae%be%e5%a4%87%e7%9a%843d%e5%b0%81%e8%a3%85ai%e8%8a%af%e7%89%87%e3%80%81%e6%95%88%e7%8e%87","status":"publish","type":"post","link":"https:\/\/www.1ai.net\/en\/3431.html","title":{"rendered":"Semron raises $7.9 million for 3D-packaged AI chips for mobile devices, 20 times more efficient"},"content":{"rendered":"<p>German companies<a href=\"https:\/\/www.1ai.net\/en\/tag\/semron\" title=\"_Other Organiser\" target=\"_blank\" >Semron<\/a>Recently raised $7.9 million (\u20ac7.3 million) to advance 3D packaging technology in mobile devices<a href=\"https:\/\/www.1ai.net\/en\/tag\/ai%e8%8a%af%e7%89%87\" title=\"[SEES ARTICLES WITH TAGS]\" target=\"_blank\" >AI Chips<\/a>Efficiency improvement. Dresden-based Semron said its goal is to set new standards for AI chips in mobile devices to meet the industry&#039;s evolving needs.<\/p>\n<p class=\"article-content__img\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-3432\" title=\"202304231132168577_6\" src=\"https:\/\/www.1ai.net\/wp-content\/uploads\/2024\/01\/202304231132168577_6.jpg\" alt=\"202304231132168577_6\" width=\"663\" height=\"436\" \/><\/p>\n<p>Source Note: The image is generated by AI, and the image is authorized by Midjourney<\/p>\n<p>The financing, led by Join Capital and supported by SquareOne, OTB Ventures, and Onsight Ventures, is intended to provide Semron with financial support for semiconductor innovation at a time when Moore&#039;s Law is slowing. In an era dominated by the demand for increasingly sophisticated AI capabilities, Semron is committed to developing advanced computer chips to power the smallest consumer devices such as smartphones, headsets, and virtual reality headsets.<\/p>\n<p>Semron ' s innovation lies in its 3D semiconductor technology, which promises to increase chip efficiency by up to 20 times. This efficiency increase allows for the operation of an AI model of up to 1,000 times the size, while maintaining the same chip size. Semron's proprietary technology, Capram, utilizes a new semiconductor device structure based on a variable capacitor (`memcapacitor'). Unlike traditional methods that rely on currents and transistors, Capram significantly reduces electronic movement, resulting in 20 times more energy efficiency at the chip level\u3002<\/p>\n<p>The seed round, led by Join Capital, attracted new investors including SquareOne, OTB Ventures, and Hermann Hauser of Onsight Ventures. Previous seed investors such as Wolfram Drescher (BlueWonder), Andreas Werner and Sven Sieber (Gigahertz Ventures), and former TSMC President Hans Rohrer also continued to support Semron.<\/p>\n<p>Semron&#039;s CapRAM technology represents a major leap forward in developing the most energy-efficient semiconductors for AI inference. The use of variable capacitors instead of current reduces noise and energy consumption, achieving a 20x improvement in energy efficiency. Notably, Semron&#039;s chips can utilize three-dimensional space without overheating, supporting AI models that are two to three hundred times larger than current capacity, with the potential to scale up to 1,000 times in the future.<\/p>\n<p>The technology utilizes conventional semiconductor materials and eliminates the need for extensive development in production, potentially saving up to $108 million (\u20ac100 million) in development costs.<\/p>\n<p>\u201cComputing resources will become the \u2018oil\u2019 of the 21st century,\u201d said SquareOne partner Georg Stockinger in a statement. \u201cAs LLMs (large language models) conquer the world with surging infrastructure demands and Moore\u2019s Law approaches its physical limits, the huge bottleneck of computing resources will shape the future. Semron will be a key factor in solving this problem by delivering a revolutionary new chip specifically designed for computing AI models. It breaks the traditional transistor-based computing paradigm and will reduce cost and energy consumption by at least 20 times for a given computing task.\u201d<\/p>\n<p>With the new funding, Semron plans to step up hardware and compiler development, expand its team, and focus on internationalization. The company aims to quadruple its team by the end of the year.<\/p>\n<p>Semron is targeting the edge device market with strong AI needs, such as digital assistants or video processing in smartphones, voice control and real-time translation in headphones, and LLMs\/GenAI in VR headsets. To date, the company has raised $10.9 million and has 11 employees.<\/p>","protected":false},"excerpt":{"rendered":"<p>German company Semron recently managed to raise $7.9 million (\u20ac7.3 million) in funding, aiming to drive up the efficiency of AI chips on mobile devices through advanced 3D packaging technology. Dresden-based Semron says they aim to set new AI chip standards on mobile devices to meet the evolving needs of the industry. Source Note: Image generated by AI, image licensed to service provider Midjourney The funding round, led by Join Capital and backed by SquareOne, OTB Ventures, and Onsight Ventures, aims to fund Semron's efforts to enable semiconductor innovation at a time when Moore's Law is slowing down. In a world where the ability for increasingly sophisticated AI<\/p>","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[146],"tags":[1099,1098],"collection":[],"class_list":["post-3431","post","type-post","status-publish","format-standard","hentry","category-news","tag-ai","tag-semron"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.1ai.net\/en\/wp-json\/wp\/v2\/posts\/3431","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.1ai.net\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.1ai.net\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.1ai.net\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.1ai.net\/en\/wp-json\/wp\/v2\/comments?post=3431"}],"version-history":[{"count":0,"href":"https:\/\/www.1ai.net\/en\/wp-json\/wp\/v2\/posts\/3431\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.1ai.net\/en\/wp-json\/wp\/v2\/media?parent=3431"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.1ai.net\/en\/wp-json\/wp\/v2\/categories?post=3431"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.1ai.net\/en\/wp-json\/wp\/v2\/tags?post=3431"},{"taxonomy":"collection","embeddable":true,"href":"https:\/\/www.1ai.net\/en\/wp-json\/wp\/v2\/collection?post=3431"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}