Packaging Design

XFUN Intelligent Packaging Design Platform is an AI-driven tool focusing on commodity packaging design, aiming to provide designers, brands and packaging factories with a full-process solution from idea generation to print file output. Incubated by Peking University's Institute for Advanced Studies in Information Technology (IASIT), the platform combines self-developed large-model and small-model synergy technology to quickly generate multiple packaging design styles, typography schemes and color schemes, and supports layered file output, greatly enhancing design efficiency. The platform has built-in rich structural templates and industry knowledge bases, including the Chinese aesthetics gene base and physical parameter knowledge base, to ensure that the design is both professional and in line with...